Lumentum Holdings Inc. (“Lumentum”) at the moment introduced plans to collectively reveal a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026 with Qualcomm Applied sciences, Inc. and Corning Integrated (NYSE: GLW). The board-level demonstration combines Qualcomm Applied sciences’ D2D interface IP subsystem with Lumentum’s IP subsystem. VCSEL-based optical interconnect platform and Corning multimode fiber connectivity. Attendees will have the ability to view demonstrations at Lumentum stand #2050 and Qualcomm Applied sciences stand #1050/MB28 throughout ECOC 2026 in Malaga, Spain.
This demonstration introduces a massively parallel optical D2D structure designed for future simultaneous package deal optics (CPO) and close to package deal optics (NPO) implementations that help new D2D interfaces equivalent to UCIe. By extending high-density D2D connections over optical hyperlinks spanning tens of meters whereas sustaining low latency and low energy consumption, this structure delivers scalable bandwidth density as AI methods drive interconnection necessities past the sensible limits of at the moment’s electrical connections.
Qualcomm Applied sciences’ D2D interface expertise allows environment friendly direct drive optical connectivity and is designed to optimize energy and space whereas sustaining the advantages of excessive bandwidth density and low energy consumption. The demonstrated proof-of-concept configuration makes use of optical channels working at 32 Gb/s NRZ to reveal how massively parallel architectures can help growing channel counts and growing per-lane knowledge charges. This structure is designed to help shoreline bandwidth densities of roughly 1 Tb/s/mm at the moment, with improved lane charges and elevated channel density leading to line-of-sight of roughly 4 Tb/s/mm.
The optical interconnect leverages Lumentum’s optical engine based mostly on extremely packaged 1060 nm VCSEL expertise with a complete transmit and obtain capability of roughly 10 Tb/s and a photodetector array with high-density two-dimensional VCSEL and bottom lens expertise. Constructed on Lumentum’s ultra-high-volume 3D sensing manufacturing basis, the platform is designed to help excessive shoreline bandwidth density, robust sign integrity, and energy-efficient optical connectivity for board-level and system-level AI scale-up architectures.
Corning’s multimode fiberglass ferrules present the high-density fiber connections used within the demonstration, highlighting the significance of fiber density as optical hyperlinks transfer nearer and nearer to computing units and superior packaging environments.
“This demonstration exhibits how Lumentum’s 1060 nm VCSEL platform can deliver high-density optical connectivity nearer to AI computing,” mentioned Matt Sysak, Chief Expertise Officer at Lumentum. Combining superior VCSEL packaging with Qualcomm Applied sciences’ D2D interface expertise and Corning’s fiber connectivity presents a sensible path to compact, energy-efficient optical D2D hyperlinks for next-generation AI scale-up architectures. ”
“Scaling up AI requires die-to-die connectivity that delivers excessive bandwidth density whereas minimizing latency, energy, and space,” mentioned Tony Chan Caruson, senior vice chairman of expertise at Qualcomm Applied sciences. This collaboration demonstrates how Qualcomm Applied sciences’ D2D interface expertise can prolong these capabilities to optical hyperlinks in future AI system architectures.
“As optical hyperlinks transfer nearer to computing units, fiber connections should help elevated density, precision, and scalability,” mentioned Claude Echahamian, vice chairman and normal supervisor, rising enterprise and EMEA, Corning Optical Communications. “Corning’s multimode fiber options and industry-leading MMC connectivity allow this demonstration and assist help the evolution of high-density optical interconnects for AI infrastructure.”
(Picture courtesy of Lumentum)
TrendForce 2026 Infrared Sensing Software Market and Model Technique
Launch: January 1, 2026
Format: PDF/EXCEL
Language: Conventional Chinese language / English
Pages: 168
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