Tresky eliminates the necessity for optical beam splitters throughout DIE bonding
Digital beam splitter strikes picture overlay from optics to software program, permitting alignment even with hidden chip constructions
Tresky GmbH takes a constant digital method to visible alignment for high-precision DIE bonding processes. Digital beam splitters eradicate the necessity for conventional optical beam splitters and use software program to mix photographs from the upward and downward going through cameras. This eliminates further optical and mechanical parameters within the beam path. This know-how additionally permits alignment duties the place conventional optical techniques are inherently restricted.
Conventional beamsplitter techniques use a bodily beamsplitter to mix mild from totally different viewpoints. The extra glass required for that is positioned instantly within the optical path, which not solely reduces mild output however also can introduce reflections, ghost photographs, or defocus. Moreover, the mechano-optical meeting should be exactly aligned.
Digital beam splitter method
Tresky takes a special method
“Why use further glass to mix the pictures from two cameras when you’ll be able to resolve this job extra exactly and with a lot higher flexibility utilizing digital strategies?” asks Daniel Schulze, CEO of Tresky GmbH. “Utilizing our digital beam splitters, we systematically transfer picture combining from optics to software program.” An upward-facing digicam captures the chip, and a downward-facing digicam captures the substrate or goal location. Each photographs are then digitally mixed and introduced to the consumer as a single aligned picture.
Straight verify and align the chip and board
Customers can immediately see the chip construction, goal construction, and present misalignment in a single view. Alignment could be carried out instantly utilizing X, Y, and Theta. Which means operators now not want to guage location based mostly solely on summary coordinates or oblique picture info. As a substitute, the operator receives direct visible suggestions on how the chip and board are literally positioned relative to one another.
“We need to present most transparency to our customers, particularly throughout growth, prototyping, and high-mix purposes.”
Schulze says. “They’ll see the precise adjustment standing and react to it immediately. This provides the client full management over the adjustment course of.” This direct visible management is especially advantageous for complicated constructions, reflective surfaces, clear supplies, or continuously altering element geometries.
No beam splitting glass, no mild splitting
Digital beamsplitters don’t require bodily mild splitting, so the sunshine output obtainable to every digicam isn’t cut up by further beamsplitters. On the identical time, you’ll be able to take full benefit of your digicam’s sensor decision. Optical results comparable to defocus, reflections, and ghost photographs attributable to further beam splitter glasses are additionally averted. Equally, delicate mechano-optical changes of the beam splitter prism usually are not required. This permits Tresky to particularly cut back the variety of optical and mechanical variables throughout the alignment system.
Digital picture processing additionally enormously will increase flexibility. Parameters comparable to transparency, scaling, zoom, distinction, brightness, rotation, and extra overlays could be adjusted in software program to swimsuit particular purposes. What’s outlined by the bodily optics of a conventional beamsplitter could be flexibly managed by the software program of a digital beamsplitter.
Predominant technical variations
Key Distinction: Optics can solely present what the attention can see
Technical variations are notably noticeable in purposes the place the related chip construction or alignment marks are hidden by the pick-up software after pick-up. Conventional optical techniques attain a elementary restrict right here. In different phrases, what’s now not bodily seen can’t be optically displayed both.
Tresky’s digital beamsplitters take issues a step additional. The system can seize a picture of the related chip construction simply earlier than pick-up and put it aside as a reference. After the chip is picked up, this picture is superimposed on the present reside picture of the board. This ensures that vital constructions for alignment are nonetheless obtainable even when they’re already obscured by a pick-up software on the precise element on the time.
“That is precisely the place it turns into clear that our digital beamsplitters usually are not simply digital copies of optical beamsplitters,” Schulze explains. “Info that’s bodily invisible in the mean time of precise alignment can be utilized for alignment.”
Advantages and makes use of
Greater than only a digital alternative for optical parts
So for Tresky, it is not only a matter of digitally replicating a conventional beam splitter. Moderately, the elimination of the bodily beam splitter paves the way in which for extra performance and new alignment methods. “The purpose is to not substitute glass with software program,” Schulze says. “The essential level is that software program permits us to do issues which might be unattainable with pure optical techniques.”
This gives particular advantages to customers. Digital beam splitters don’t bodily cut up the sunshine. The complete decision of the digicam sensor is out there for alignment. On the identical time, optical results comparable to ghost photographs and focus shifts attributable to beam splitter glasses are averted. It additionally eliminates the changes required with mechanical optical beam splitters. The system permits direct visible inspection of the chip and goal constructions and gives a excessive diploma of flexibility with software-based picture show. Moreover, beforehand captured chip constructions can nonetheless be used for positioning and course of management even when they’re bodily hidden in later processes.
Digital beamsplitters are due to this fact notably appropriate for demanding DIE bonding processes in R&D, prototyping, high-mix low-volume manufacturing, photonics, optoelectronics, and superior packaging.
Digital alignment replaces optical compromises
Tresky constantly pursues a philosophy of mixing mechanical precision with clever digital course of assist utilizing digital beamsplitters.
“In high-precision DIE bonding, just some micrometers could make an enormous distinction within the course of,” Schultze summarizes. “That is why we need to see as precisely as attainable what’s truly occurring, whereas on the identical time eliminating pointless optical and mechanical variables. Digital beamsplitters give us precisely that functionality.”
